Oled touch and display driver integration chip and oled touch display apparatus including thereof

ABSTRACT

An OLED touch and display driver integration chip is provided, including: at least one group of display driving pads for providing display driving signals to the OLED touch display panel; at least one group of touch pads for providing touch driving signals to touch electrodes on the OLED touch display panel, and alternately arranged in groups with the at least one group of display driving pads; at least one group of isolation pads, each group of isolation pads includes at least one isolation pad and is arranged between a group of display driving pads and a group of touch pads that are adjacent, an isolation pad is configured to apply a specific signal to isolate signal interference between adjacent groups of display driving pads and touch pads, or configured to apply a specific signal or be in a floating state, to reduce load of data lines or the touch electrodes.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims priority to U.S. Provisional Application No.63/028,573 filed on May 22, 2020 and U.S. Provisional Application No.63/059,189 filed on Jul. 31, 2020, which are incorporated herein byreference in their entirety.

TECHNICAL FIELD

This application relates to a field of touch and display technology, andin particular, to an OLED touch and display driver integration chip, andan OLED touch display apparatus including the OLED touch and displaydriver integration chip.

BACKGROUND

It is known that, by using Touch and Display Driver Integration (TDDI)technologies, a touch chip and a display chip may be integrated as asingle touch and display driver integration chip (i.e., a TDDI chip), soas to improve integration of a touch display apparatus.

A traditional LCD TDDI chip has only a small number of display drivingpads and touch pads that are alternately arranged in groups, and sincethe traditional chip adopts time division driving manner of display andtouch, there will be no interference between a group of display drivingpads and a group of touch pads that are adjacent. A future OLED TDDIchip will still adopt a structure in which display driving pads andtouch pads are alternately arranged in groups. However, in order toavoid the occurrence of the problem of display bright and dark bands,the OLED TDDI chip will not adopt the time division driving manner, anda display operation period and a touch operation period will at leastpartially overlap. In this case, there will be mutual interference(including the interference on the chip and the interference on thefanout area where pad lead wires are located) between a group of displaydriving pads and a group of touch pads that are adjacent, which finallyleads to reduced Signal-to-Noise Ratio (SNR) of touch signals in termsof touching, and appearance of multi-band phenomenon in terms ofdisplaying due to deviation of the pixel voltage from an expected targetvoltage caused by touching signals being coupled to driving pads.

In addition, there is a coupling capacitance between a touch pad leadwire and a display driving pad lead wire that are adjacent in the fanoutarea, which leads to a large load on corresponding touch electrodes anddata line.

Therefore, there is a need for a new type of OLED touch and displaydriver integration chip to reduce interference between a group ofdisplay driving pads and a group of touch pads that are adjacent, and toreduce the large load caused by the coupling capacitance between leadwires.

SUMMARY OF THE DISCLOSURE

To this end, the present disclosure proposes an OLED touch and displaydriver integration chip and an OLED touch display apparatus includingthe OLED touch and display driver integration chip.

According to one aspect of the present disclosure, there is provided anOLED touch and display driver integration chip for driving an OLED touchdisplay panel. The OLED touch and display driver integration chipcomprising: at least one group of display driving pads for providingdisplay driving signals to the OLED touch display panel; at least onegroup of touch pads for providing touch driving signals to touchelectrodes on the OLED touch display panel, and alternately arranged ingroups with the at least one group of display driving pads; and at leastone group of isolation pads, wherein each group of isolation padsincludes at least one isolation pad and is arranged between a group ofdisplay driving pads and a group of touch pads that are adjacent, and anisolation pad of the at least one group of isolation pads is configuredto apply a specific signal to isolate signal interference between thegroup of display driving pads and the group of touch pads that areadjacent.

According to another aspect of the present disclosure, there is providedanother OLED touch and display driver integration chip for driving anOLED touch display panel. The OLED touch and display driver integrationchip comprising: at least one group of display driving pads forproviding display driving signals to the OLED touch display panel; atleast one group of touch pads for providing touch driving signals totouch electrodes on the OLED touch display panel, and alternatelyarranged in groups with the at least one group of display driving pads;and at least one group of isolation pads, wherein each group ofisolation pads includes at least one isolation pad and is arrangedbetween a group of display driving pads and a group of touch pads thatare adjacent, and an isolation pad of the at least one group ofisolation pads is configured to apply a specific signal or be in afloating state, to reduce load of data lines of the OLED touch displaypanel to which the group of display driving pads are coupled, or load ofthe touch electrodes on the OLED touch display panel to which the groupof touch pads are coupled.

According to yet another aspect of the present disclosure, there isprovided an OLED touch display apparatus, comprising the above-mentionedOLED touch and display driver integration chip, or another OLED touchand display driver integration chip, and a OLED touch display panelcoupled to the OLED touch and display driver integration chip.

In order to make the above features and advantages of the presentdisclosure more comprehensible, embodiments are presented below and aredescribed in detail in connection with accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are used to provide a further understanding ofthe embodiments of the present disclosure, which constitute a part ofthe specification, and explain the present disclosure together with theembodiments of the present disclosure, but do not constitute alimitation to the present disclosure. In the accompanying drawings, thesame reference numerals usually represent the same components or steps.

FIG. 1 shows a schematic diagram of a pad arrangement on an OLED TDDIchip in the prior art.

FIG. 2 shows a schematic diagram of a pad arrangement on an OLED TDDIchip according to an embodiment of the present disclosure.

FIG. 3 shows a schematic diagram of an arrangement of the lead wires ofthe isolation pads according to an embodiment of the present disclosure.

FIG. 4 shows a timing diagram of display and touch according to anembodiment of the present disclosure.

FIG. 5 shows a first example of a position arrangement of isolation padsand a signal with a preset voltage waveform according to an embodimentof the present disclosure.

FIG. 6 shows a second example of a position arrangement of isolationpads and a signal with a preset voltage waveform according to anembodiment of the present disclosure.

FIG. 7 shows a third example of a position arrangement of isolation padsand a signal with a preset voltage waveform according to an embodimentof the present disclosure.

FIG. 8 shows a schematic diagram of an OLED TDDI chip being bonded withan OLED touch display panel by using a COG packaging structure accordingto an embodiment of the present disclosure.

FIG. 9 shows a schematic diagram of an OLED TDDI chip being bonded withan OLED touch display panel by using a COP packaging structure accordingto an embodiment of the present disclosure.

FIG. 10 shows a schematic diagram of an OLED TDDI chip being bonded withan OLED touch display panel by using a COF packaging structure accordingto an embodiment of the present disclosure.

FIG. 11 shows a fourth example of a position arrangement of isolationpads and a signal with a preset voltage waveform according to anembodiment of the present disclosure.

FIG. 12 shows a fifth example of a position arrangement of isolationpads and a signal with a preset voltage waveform according to anembodiment of the present disclosure.

FIG. 13 shows a sixth example of a position arrangement of isolationpads and a signal with a preset voltage waveform according to anembodiment of the present disclosure.

DESCRIPTION OF THE EMBODIMENTS

The terms “first”, “second” and the like referenced throughout thespecification of the present disclosure (including the claims) are usedto name elements, or to distinguish different embodiments or scopes,rather than to limit an upper or lower limit of the number of theelements, or to limit an order of the elements. In addition, whereverpossible, elements/members/steps with the same reference numerals in theaccompanying drawings and the embodiments represent the same or similarparts. Elements/members/steps using the same reference numerals or usingthe same terms in different embodiments may refer to relateddescriptions.

First, a pad arrangement of an OLED touch and display driver integration(TDDI) chip for reducing interference according to the embodiments ofthe present disclosure will be introduced.

According to the embodiments of the present disclosure, under thecurrent architecture in which display driving pads and touch pads arealternately arranged in groups on an OLED TDDI chip, by adding anisolation pad between a group of display driving pads and a group oftouch pads that are adjacent, and using the isolation pad to apply aspecific signal to a lead wire to which it is connected, interferencebetween the group of display driving pads and the group of touch padsthat are adjacent is reduced.

FIG. 1 shows a schematic diagram of a pad arrangement on an OLED TDDIchip in the prior art. As shown in FIG. 1, an OLED TDDI chip 101includes at least one group of display driving pads 1-N and at least onegroup of touch pads 1-N that are alternately arranged in groups, wheredisplay driving pads 1 are a group of display driving pads, touch pads 1are a group of touch pads arranged adjacent to the display driving pads1, and so on, a total of N groups of display driving pads and N groupsof touch pads are shown in the figure. However, the present disclosuredoes not limit the number of the display driving pad groups and thetouch pad groups arranged on the OLED TDDI chip, nor does it limit thenumber of pads in respective pad groups.

Each display driving pad in FIG. 1 may be coupled to a data line on theOLED touch display panel, and provide a display driving signal to acapacitor of a corresponding display pixel via the data line to chargethe capacitor, thereby driving the OLED to emit light. Each touch pad inFIG. 1 may provide a touch driving signal to a touch electrode on theOLED touch display panel. As shown in FIG. 1, due to the architecture inwhich the display driving pads and the touch pads are alternatelyarranged in groups, in the case that the OLED TDDI chip does not adoptthe time division driving manner, the display driving signal provided bya group of display driving pads and the touch driving signal provided byan adjacent group of touch pads will interfere with each other, therebyaffecting display effect and sensitivity of touch detection.

FIG. 2 shows a schematic diagram of a pad arrangement on an OLED TDDIchip according to an embodiment of the present disclosure. As shown inFIG. 2, in order to reduce signal interference between a group ofdisplay driving pads and a group of touch pads that are adjacent, atleast one group of isolation pads 1-M are added on the OLED TDDI chip101, and each group of isolation pads is arranged between a group ofdisplay driving pads and a group of touch pads that are adjacent. Itshould be noted that, although it is shown in FIG. 1 that each group ofisolation pads only includes one isolation pad, each group of isolationpads may also include more than one isolation pad, as will be describedin detail below.

After adding the aforementioned isolation pads, some or all of theisolation pads may be further utilized to apply specific signals totheir lead wires, so as to isolate signal interference between a groupof display driving pads and a group of touch pads that are adjacent. Thetypes of the specific signals and the position arrangement of theisolation pads will be further described below.

An arrangement of the lead wires of the isolation pads according to anembodiment of the present disclosure will be described below inconnection with FIG. 3. FIG. 3 shows a schematic diagram of anarrangement of the lead wires of the isolation pads according to anembodiment of the present disclosure. It should be noted that FIG. 3 isonly an illustration, and is not intended to limit the line widths,spacing or tracing directions of the lead wires. In fact, thearrangement of the lead wires in the fanout area 303 may be fan-shaped.

Specifically, each isolation pad may be configured to be connected toone end of a lead wire, and the other end of the lead wire may extendtoward the direction of the OLED touch display panel and not extend intothe display active area (AA) of the OLED touch display panel. Forexample, as shown in FIG. 3, the other ends of lead wires 301 connectingto respective isolation pads may extend through a fanout area 303 to anedge of an display active area 302, but do not extend into the displayactive area 302. Therefore, by enabling the respective isolation pads toapply specific signals to their lead wires 301, not only interferencethat occurs on the OLED TDDI chip 101 can be reduced, but alsointerference that occurs on the fanout area 303 (that is, interferencethat occurs between a touch pad lead wire and a display driving pad leadwire that are adjacent) can be reduced. FIG. 3 may describe a packagingstructure in which the OLED TDDI chip 101 is bonded with a substrate ofthe OLED touch display panel, such as COG (Chip on Glass) or COP (Chipon Plastic) packaging structure. In the above packaging structures, alead wire 301 is a part of a fanout line in the fanout area 303. Inanother example of the packaging structure, in particular to thepackaging structures in which the OLED TDDI chip 101 is bonded with thesubstrate of the OLED touch display panel through another substrate,such as COF (Chip On Film) packaging structure, a part of a lead wire301 is in the fanout area 303, and the other part of the lead wire 301is a wire (not shown) on the substrate in the COF packaging structurethat connects a pad of the OLED TDDI chip 101 and an outer lead. Inanother example of the COF packaging structure, the other ends of thelead wires 301 may only extend to the edge of the fanout area 303 andnot into the fanout area 303 (not shown), so as to meet specific tracingdesign requirements, which is not limited herein.

Next, the types of the specific signals applied by the isolation pads toisolate signal interference will be described. It should be noted thatdifferent isolation pads may be used to apply the same or differentspecific signals, or only a part of the isolation pads may be used toapply specific signals, while the other part of the isolation pads arein a floating state. However, in order to achieve a better interferencereduction effect, it is preferable to use all the isolation pads toapply specific signals for isolating signal interference.

Specifically, a specific signal applied by an isolation pad may be oneof: a ground signal, a signal with a fixed potential, and a signal witha preset voltage waveform.

In one example, in order to reduce interference caused by the displaydriving signals on the display driving pads, the signal with a presetvoltage waveform may be a signal with at least one same signalcharacteristic and at least one different signal characteristic as adisplay driving signal, where the signal characteristic includes atleast a part of frequency, phase, amplitude, slew rate, and DC offset.

Preferably, the signal with a preset voltage waveform may be a signalwith a same frequency and a reverse phase as the display driving signal,so as to better cancel the interference caused by the display drivingsignal. In the case that the signal with a preset voltage waveform has asame frequency and a reverse phase as the display driving signal, theabove two kinds of signals may further be the same in at least onesignal characteristic, where the at least one signal characteristic maybe at least one of amplitude, slew rate, and DC offset. Therefore, whenthe signal with a preset voltage waveform having a same frequency and areverse phase as the display driving signal is closer to the displaydriving signal in other signal characteristic(s), the signal with apreset voltage waveform can perform better interference suppressioneffect, thereby reducing interference suffered by the touch padsadjacent to the isolation pad.

In this example, the signal with a preset voltage waveform may have asame frequency as the display driving signal, and the signal with apreset voltage waveform may also be different from the display drivingsignal in at least one signal characteristic, where the at least onesignal characteristic may be at least one of phase, amplitude, slewrate, and DC offset. For example, the signal with a preset voltagewaveform may be a signal with a same frequency but a not completelyreverse phase (that is, the phase difference is not 180 degrees) as thedisplay driving signal, and the phase difference between the signal witha preset voltage waveform and the display driving signal may be close to180 degrees, thereby also providing corresponding interferencesuppression effect.

In another example, in order to reduce interference caused by the touchdriving signals on the touch pads, the signal with a preset voltagewaveform may be a signal with at least one same signal characteristicand at least one different signal characteristic as a touch drivingsignal, where the signal characteristic includes at least a part offrequency, phase, amplitude, slew rate, and DC offset.

Preferably, the signal with a preset voltage waveform may be a signalwith a same frequency and a reverse phase as the touch driving signal,so as to better cancel the interference caused by the touch drivingsignal. In the case that the signal with a preset voltage waveform has asame frequency and a reverse phase as the touch driving signal, theabove two kinds of signals may further be the same in at least onesignal characteristic, where the at least one signal characteristic isat least one of amplitude, slew rate, and DC offset. Therefore, when thesignal with a preset voltage waveform having a same frequency and areverse phase as the touch driving signal is closer to the touch drivingsignal in other signal characteristic(s), the signal with a presetvoltage waveform can perform better interference suppression effect,thereby reducing interference suffered by the display driving padsadjacent to the isolation pad.

In this example, the signal with a preset voltage waveform may have asame frequency as the touch driving signal, and the signal with a presetvoltage waveform is also different from the touch driving signal in atleast one signal characteristic, where the at least one signalcharacteristic is at least one of phase, amplitude, slew rate, and DCoffset. For example, the signal with a preset voltage waveform may be asignal with a same frequency but a not completely reverse phase (thatis, the phase difference is not 180 degrees) as the touch drivingsignal, and the phase difference between the signal with a presetvoltage waveform and the touch driving signal may be close to 180degrees, thereby also providing corresponding interference suppressioneffect.

A period during which the signal with a preset voltage waveform isapplied according to an embodiment of the present disclosure will bedescribed below in connection with FIG. 4. FIG. 4 shows a timing diagramof display and touch according to an embodiment of the presentdisclosure.

Specifically, FIG. 4 schematically shows a display frame period 401 witha length of 16.6 ms and a touch frame period 402 with a length of 8.3 msbased on a display scan rate of 60 Hz and a touch scan rate of 120 Hz,where one display frame period 401 is equivalent to two touch frameperiods 402. The display driving signals are provided during a displayoperation period 403 within each display frame period 401, and the touchdriving signals are provided during a touch operation period 404 withineach touch frame period 402. In addition, each display frame period 401further includes a plurality of frame scan blanking periods (i.e.,Vertical blanking periods) 405 and row scan blanking periods (i.e.,Horizontal blanking periods) 406 during which the display drivingsignals are not provided, and each touch frame period 402 furtherincludes a touch interval period 407 during which the touch drivingsignals are provided.

As shown in FIG. 4, the display operation period 403 and the touchoperation period 404 are at least partially overlapped, and theisolation pad may be configured to apply the signal with a presetvoltage waveform during an overlapped operation period in which thedisplay operation period 403 and the touch operation period 404 are atleast partially overlapped. That is, the isolation pad may be configuredto apply the signal with a preset voltage waveform for reducinginterference only during a period when interference between display andtouch actually occurs (that is, the aforementioned overlapped operationperiod).

In a non-interference period during which the display driving signalsare not provided or the touch driving signals are not provided, that is,the aforementioned frame scan blanking period 405, row scan blankingperiod 406, and touch interval period 407, the isolation pad may notapply the signal with a preset voltage waveform for reducinginterference. Alternatively, in the non-interference period, theisolation pad may be used to reduce a large load on the data line or thetouch electrodes caused by the coupling capacitance between the leadwires. Specifically, the isolation pad may be configured to apply aground signal or to be in a floating state during at least one of theframe scan blanking periods, the row scan blanking periods and the touchinterval period, so as to reduce the large load caused by the couplingcapacitance, as will be further described in detail below.

Next, an example of a position arrangement of isolation pads and asignal with a preset voltage waveform according to an embodiment of thepresent disclosure will be described in connection with FIG. 5. FIG. 5shows a first example of a position arrangement of isolation pads and asignal with a preset voltage waveform according to an embodiment of thepresent disclosure.

As shown in FIG. 5, a first group of isolation pads 501 are arrangedbetween a first group of display driving pads 502 and a first group oftouch pads 503 that are adjacent, which include a first isolation pad504 and a second isolation pad 505. The first isolation pad 504 may beconfigured to apply a signal with a preset voltage waveform during theoverlapped operation period, where the signal with a preset voltagewaveform may be a signal with a same frequency and a reverse phase as atouch driving signal, or a signal with a same frequency and a reversephase as a display driving signal of the first group of display drivingpads 502. That is, the first isolation pad 504 may be configured toapply a signal with a same frequency and a reverse phase as the touchdriving signal or the display driving signal, so as to reduceinterference caused by the touch driving signal or the display drivingsignal. For example, FIG. 5 shows that the first isolation pad 504 isconfigured to apply a signal with a same frequency and a reverse phaseas the display driving signal, so as to reduce the interference causedby the display driving signal. In the case where the first isolation pad504 is configured to apply a signal with a same frequency and a reversephase as the display driving signal of the first group of displaydriving pads 502, if different pads of the first group of displaydriving pads 502 have different display driving signals, the signal witha same frequency and a reverse phase may be applied according to thedisplay driving signal on the display driving pad that is closest to thefirst isolation pad 504 in position.

In this example, since the second isolation pad 505 is arranged betweenthe first group of touch pads 503 and the first isolation pad 504, thesecond isolation pad 505 may be configured to be floated or to apply asignal with a same frequency and a same phase as the touch drivingsignal during the touch operation period, so as to isolate a couplingcapacitance between a lead wire of the first isolation pad 504 and anadjacent touch pad lead wire (i.e., one of the lead wires of the firstgroup of touch pads 503 that is closest to the lead wire of the firstisolation pad 504 in position). That is, the second isolation pad 505may be used to reduce a large load on the touch electrodes caused by thecoupling capacitance between the lead wire of the first isolation pad504 and the adjacent touch pad lead wire, so as to protect the touchdriving signal from influence of the signal on the lead wire of thefirst isolation pad 504, thereby improving touch sensitivity.

FIG. 6 shows a second example of a position arrangement of isolationpads and a signal with a preset voltage waveform according to anembodiment of the present disclosure.

As shown in FIG. 6, a first group of isolation pads 601 are arrangedbetween a first group of display driving pads 602 and a first group oftouch pads 603 that are adjacent, which include a first isolation pad604 and a second isolation pad 605. The first isolation pad 604 may beconfigured to apply a signal with a preset voltage waveform during theoverlapped operation period, where the signal with a preset voltagewaveform may be a signal with a same frequency and a reverse phase asthe touch driving signal, or a signal with a same frequency and areverse phase as the display driving signal of the first group ofdisplay driving pads 602. That is, the first isolation pad 604 may beconfigured to apply a signal with a same frequency and a reverse phaseas the touch driving signal or the display driving signal, so as toreduce interference caused by the touch driving signal or the displaydriving signal. For example, FIG. 6 shows that the first isolation pad604 is configured to apply a signal with a same frequency and a reversephase as the touch driving signal, so as to reduce the interferencecaused by the touch driving signal. Similarly, in the case where thefirst isolation pad 604 is configured to apply the signal with a samefrequency and a reverse phase as the display driving signal of the firstgroup of display driving pads 602, if different pads of the first groupof display driving pads 602 have different display driving signals, thesignal with a same frequency and a reverse phase may be appliedaccording to the display driving signal on the display driving pad thatis closest to the first isolation pad 604 in position.

In this example, since the second isolation pad 605 is arranged betweenthe first group of display driving pads 602 and the first isolation pad604, the second isolation pad 605 may be configured to be floated orapply a signal with a same frequency and a same phase as the displaydriving signal of the first group of display driving pads 602 during thedisplay operation period, so as to isolate the coupling capacitancebetween the lead wire of the first isolation pad 604 and an adjacentdisplay driving pad lead wire (i.e., one of the lead wires of the firstgroup of display driving pads 602 that is closest to the lead wire ofthe first isolation pad 604 in position). That is, the second isolationpad 605 may be used to reduce a large load on the data line caused bythe coupling capacitance between the lead wire of the first isolationpad 604 and the adjacent display driving pad lead wire, so as to protectthe display driving signal from influence of the signal on the lead wireof the first isolation pad 604, thereby improving display effect.Similarly, if different pads of the first group of display driving pads602 have different display driving signals, the signal with a samefrequency and a same phase may be applied according to the displaydriving signal on the display driving pad that is closest to the firstisolation pad 604 in position.

As described above, in the above case where the signal with a presetvoltage waveform is the signal with a same frequency and a reverse phaseas the touch driving signal, the above signal with a preset voltagewaveform may further be the same as the touch driving signal in at leastone signal characteristic; and, in the above case where the signal witha preset voltage waveform is the signal with a same frequency and areverse phase as the display driving signal of the first group ofdisplay driving pads 502 or 602, the above signal with the presetvoltage waveform may further be the same as the display driving signalof the first group of display driving pads 502 or 602 in at least onesignal characteristic, where the at least one signal characteristic isat least one of amplitude, slew rate, and DC offset. That is, whenapplying the signal with a same frequency and a reverse phase forinterference reduction, the signal with a same frequency and a reversephase may be made as the same as possible with the corresponding touchdriving signal or display driving signal in other signalcharacteristic(s), so as to achieve better interference suppressioneffect.

In addition, as described above, each display frame period also includesthe frame scanning blanking periods and the row scanning blankingperiods during which the display driving signals are not provided, andeach touch frame period also includes the touch interval period duringwhich the touch driving signals are provided. Therefore, the firstisolation pad 504 or 604 may be configured to apply the signal with apreset voltage waveform only during the overlapped operation period inwhich interference actually occurs so as to reduce interference, andconfigured to reduce load during the frame scan blanking periods, therow scan blanking periods and the touch interval period in whichinterference does not occur. Specifically, the first isolation pad 504or 604 may be configured to apply a ground signal or be in a floatingstate during at least one of the frame scan blanking periods, the rowscan blanking periods and the touch interval period, so as to reduce thelarge load on the data line or the touch electrodes caused by thecoupling capacitance.

FIG. 7 shows a third example of a position arrangement of isolation padsand a signal with a preset voltage waveform according to an embodimentof the present disclosure.

Compared with the first group of isolation pads 501 shown in FIG. 5including the first isolation pad 504 and the second isolation pad 505,the first group of isolation pads 501 shown in FIG. 7 further includes athird isolation pad 701 arranged between the first isolation pad 504 andthe second isolation pad 505. The third isolation pad 701 may beconfigured to drive an entire layer of isolation electrodes between alayer in the OLED display panel structure nearest to the touchelectrodes (for example, the cathode of OLED) and the touch electrodesof the OLED touch display panel, so as to reduce load on the touchelectrodes. Specifically, the third isolation pad 701 may be configuredto provide, during the touch operation period, a loading free drivingsignal with a same frequency and a same phase as the touch drivingsignal to the isolation electrodes between the cathode of OLED and thetouch electrodes of the OLED touch display panel. Taking a commonon-cell OLED touch display panel as an example, the touch electrodes aredisposed above the OLED display panel, and the cathode of OLED of theOLED display panel is closest to the touch electrodes. In anotheron-cell OLED touch display panel, it may be the anode of OLED that isclosest to the touch electrodes. Therefore, in general, theaforementioned isolation electrodes may be an entire layer of electrodesbetween the OLED display panel and the on-cell touch electrodes. Itshould be noted that, due to a large load of the entire layer ofisolation electrodes, the slew rate of the loading free driving signalmay be changed, resulting in different slew rates between the loadingfree driving signal and the touch driving signal (as shown by the arrowsin FIG. 7), that is, making the loading free driving signal and thetouch driving signal actually not completely the same in phase.Therefore, in this example, the third isolation pad 701 is not directlyadjacent to the first group of touch pads 503, but is directly adjacentto the second isolation pad 505, and the second isolation pad 505 may beconfigured to apply a signal with a same frequency and a same phase asthe touch driving signal during the touch operation period, so as toisolate the coupling capacitance between the lead wire of the thirdisolation pad 701 and an adjacent touch pad lead wire. Alternatively, inanother example, the first isolation pad 504 in FIG. 7 close to thedisplay driving pads may be configured to apply a signal with a samefrequency and a reverse phase (or close to a reverse phase) as the touchdriving signal to reduce interference caused by the touch drivingsignal.

Next, examples of methods for bonding an OLED TDDI chip with an OLEDtouch display panel according to the embodiments of the presentdisclosure will be described in connection with FIGS. 8-10. Descriptionof elements not related to the present disclosure is omitted below andin the drawings to avoid confusion.

Specifically, an OLED touch display apparatus according to an embodimentof the present disclosure may include the aforementioned OLED touch anddisplay driver integration chip and an OLED touch display panel coupledwith the OLED touch and display driver integration chip. At least onelead wire is provided on a substrate of the OLED touch display panel,and the at least one group of isolation pads on the OLED touch anddisplay driver integration chip are connected to one end of the at leastone lead wire. As described above, the other end of the lead wire mayextend toward the direction of the OLED touch display panel and does notextend into the display active area of the OLED touch display panel. TheOLED touch and display driver integration chip may be bonded with theOLED touch display panel by using any one of COG (Chip on Glass), COP(Chip on Plastic) and COF (Chip On Flex or Chip On Film) packagingstructures, and the configuration of the lead wires will be describedbelow in connection with a specific packaging structure.

FIG. 8 shows a schematic diagram of an OLED TDDI chip being bonded withan OLED touch display panel by using a COG packaging structure accordingto an embodiment of the present disclosure. As shown in FIG. 8, an OLEDTDDI chip 801 is arranged on a substrate 802 of an OLED touch displaypanel, and at least one group of isolation pads on the OLED TDDI chip801 may be directly connected to one end of at least one lead wire 803arranged on the substrate 802. In an example, as shown in FIG. 8, theother end of the at least one lead wire 803 extends through the fanoutarea to the edge of the display active area (simply referred to as AAarea) of the OLED touch display panel and does not extend into the AAarea. In another example, the at least one lead wire 803 may also extendinto the AA area, and in this case, the at least one lead wire 803 andtouch sensing lines may be located on a same metal layer.

FIG. 9 shows a schematic diagram of an OLED TDDI chip being bonded withan OLED touch display panel by using a COP packaging structure accordingto an embodiment of the present disclosure. As shown in FIG. 9, an OLEDTDDI chip 901 is arranged on a substrate 902 of an OLED touch displaypanel, and at least one group of isolation pads on the OLED TDDI chip901 may be directly connected to one end of at least one lead wire 903arranged on the substrate 902. In an example, as shown in FIG. 9, theother end of the at least one lead wire 903 extends through the fanoutarea to the edge of the AA area of the OLED touch display panel and doesnot extend into the AA area. In another example, the at least one leadwire 903 may also extend into the AA area, and in this case, the atleast one lead wire 903 and touch sensing lines may be located on a samemetal layer.

FIG. 10 shows a schematic diagram of an OLED TDDI chip being bonded withan OLED touch display panel by using a COF packaging structure accordingto an embodiment of the present disclosure. Unlike the COG and COPpackaging structures in which the TDDI chip is directly arranged on thesubstrate of the OLED touch display panel, in the COF packagingstructure, an OLED TDDI chip 1001 is packaged on a Flexible PrintedCircuit (FPC) 1004, as shown in FIG. 10. Therefore, at least one groupof isolation pads of the OLED TDDI chip 1001 are directly connected toat least one additional lead wire (not shown) on the FPC 1004. In thiscase, the at least one group of isolation pads of the OLED TDDI chip1001 may be connected to at least one lead wire 1003 on a substrate 1002via the at least one additional lead wire, so as to be bonded with thesubstrate 1002. In another example, in order to meet specific tracingdesign requirements, the at least one lead wire 1003 may not be providedon the substrate 1002, but only at least one lead wire on the FPC 1004is used as the lead wire of the at least one group of isolation pads,and in this case, the at least one lead wire of the isolation pads onlyextend to the edge of the fanout area and does not extend into thefan-out area.

Therefore, the OLED touch and display driver integration chip and theOLED touch display apparatus including the chip according to theembodiments of the present disclosure may reduce interference between agroup of display driving pads and a group of touch pads that areadjacent, and furthermore, may further reduce load of the data lines ofthe OLED touch display panel to which the group of display driving padsare coupled, or load of the touch electrodes on the OLED touch displaypanel to which the group of touch pads are coupled, thereby achievingbetter display effect and touch sensitivity.

Next, a pad arrangement of an OLED TDDI chip for load reductionaccording to the embodiments of the present disclosure will beintroduced. It should be noted that since the pad arrangement for loadreduction is substantially the same in position as the pad arrangementfor interference reduction as described above, the pad arrangement forload reduction will be described specifically in connection with thesame drawings as mentioned above.

According to the embodiments of the present disclosure, under thecurrent architecture in which display driving pads and touch pads arealternately arranged in groups on an OLED TDDI chip, by adding anisolation pad between a group of display driving pads and a group oftouch pads that are adjacent, and using the isolation pad to apply aspecific signal to a lead wire to which it is connected, or making theisolation pad to be in a floating state, load of data lines of the OLEDtouch display panel to which the group of display driving pads arecoupled, or load of touch electrodes on the OLED touch display panel towhich the group of touch pads are coupled may be reduced.

FIG. 1 shows a schematic diagram of a pad arrangement on an OLED TDDIchip in the prior art. As shown in FIG. 1, an OLED TDDI chip 101includes at least one group of display driving pads 1-N and at least onegroup of touch pads 1-N that are alternately arranged in groups. Eachdisplay driving pad may be coupled to a data line on the OLED touchdisplay panel, and provide a display driving signal to a capacitor of acorresponding display pixel via the data line to charge the capacitor,thereby driving the OLED to emit light. Each touch pad may provide atouch driving signal to touch electrodes on the OLED touch displaypanel. As shown in FIG. 1, due to the architecture in which the displaydriving pads and the touch pads are alternately arranged in groups,there is a large coupling capacitance between a touch pad lead wire andan adjacent display driving pad lead wire in the fanout area, whichleads to a large load in corresponding touch electrodes and data line,and thus affect display effect and sensitivity of touch detection.

FIG. 2 shows a schematic diagram of a pad arrangement on an OLED TDDIchip according to an embodiment of the present disclosure. As shown inFIG. 2, in order to reduce load of data lines of the OLED touch displaypanel to which a group of display driving pads are coupled, or load oftouch electrodes on the OLED touch display panel to which a group oftouch pads are coupled, at least one group of isolation pads 1-M areadded on the OLED TDDI chip 101, and each group of isolation pads isarranged between a group of display driving pads and a group of touchpads that are adjacent. It should be noted that, although it is shown inFIG. 1 that each group of isolation pads only includes one isolationpad, each group of isolation pads may also include more than oneisolation pad, as will be described in detail below.

After adding the aforementioned isolation pads, some or all of theisolation pads may be further utilized to apply specific signals totheir lead wires, or may be in a floating state, so as to isolate thecoupling capacitance between a touch pad lead wire and an adjacentdisplaying driving pad lead wire, thereby reducing the load oncorresponding touch electrodes or data lines. The types of the specificsignals and a position arrangement of isolation pads will be furtherdescribed below.

An arrangement of the lead wires of the isolation pads according to anembodiment of the present disclosure will be described below inconnection with FIG. 3. FIG. 3 shows a schematic diagram of anarrangement of the lead wires of the isolation pads according to anembodiment of the present disclosure. It should be noted that FIG. 3 isonly an illustration, and is not intended to limit the line widths,spacing or tracing directions of the lead wires. In fact, thearrangement of the lead wires in the fanout area 303 may be fan-shaped.

Specifically, each isolation pad may be configured to be connected toone end of a lead wire, and the other end of the lead wire may extendtoward the direction of the OLED touch display panel and not extend intothe display active area of the OLED touch display panel. For example, asshown in FIG. 3, the other ends of lead wires 301 connecting torespective isolation pads may extend to an edge of the display activearea 302 through a fanout area 303, but does not extend into the displayactive area 302. Therefore, by enabling the respective isolation pads toapply specific signals to their lead wires 301 or setting the isolationpads in a floating state, the coupling capacitance between a touch padlead wire and an adjacent displaying driving pad lead wires in thefanout area 303 may be isolated. FIG. 3 may describe a packagingstructure in which the OLED TDDI chip 101 is bonded with a substrate ofthe OLED touch display panel, such as COG (Chip on Glass) or COP (Chipon Plastic) packaging structure. In the above packaging structures, alead wire 301 is a part of a fanout line in the fanout area 303. Inanother example of the packaging structure, in particular to thepackaging structures in which the OLED TDDI chip 101 is bonded with thesubstrate of the OLED touch display panel through another substrate,such as COF (Chip On Film) packaging structure, a part of a lead wire301 is in the fanout area 303, and the other part of the lead wire 301is a wire (not shown) on the substrate in the COF packaging structurethat connects a pad of the OLED TDDI chip 101 and an outer lead. Inanother example of the COF packaging structure, the other ends of thelead wires 301 may only extend to the edge of the fanout area 303 andnot into the fanout area 303 (not shown), so as to meet specific tracingdesign requirements, which is not limited herein.

Next, the types of the specific signals applied by the isolation padsfor load reduction will be described. It should be noted that differentisolation pads may be used to apply the same or different specificsignals, or only a part of the isolation pads may be used to apply thespecific signals, while the other part of the isolation pads are set ina floating state. However, in order to achieve a better load reductioneffect, it is preferable to enable an isolation pad to apply a signalwith a same frequency and a same phase as a display driving signal and atouch driving signal, or set the isolation pad in a floating state.

Specifically, a specific signal applied by an isolation pad may be oneof: a ground signal, a signal with a fixed potential, and a signal witha preset voltage waveform.

In one example, in order to reduce load of data lines to which a groupof display driving pads are coupled, the signal with a preset voltagewaveform may be a signal with at least one same signal characteristic asa display driving signal, where the signal characteristic includes atleast a part of frequency, phase, amplitude, slew rate, and DC offset.

Preferably, the signal with a preset voltage waveform may be a signalwith a same frequency and a same phase as the display driving signal, soas to better achieve the effect of load reduction. In the case that thesignal with a preset voltage waveform has a same frequency and a samephase as the display driving signal, the above two kinds of signals mayfurther be the same in at least one signal characteristic, where the atleast one signal characteristic is at least one of amplitude, slew rate,and DC offset. Therefore, when the signal with a preset voltage waveformhaving a same frequency and a same phase as the display driving signalis closer to the display driving signal in other signalcharacteristic(s), the signal with a preset voltage waveform can performbetter load reduction effect.

In this example, the signal with a preset voltage waveform may have asame frequency as the display driving signal, and the signal with apreset voltage waveform is also different from the display drivingsignal in at least one signal characteristic, where the at least onesignal characteristic is at least one of phase, amplitude, slew rate,and DC offset. For example, the signal with a preset voltage waveformmay be a signal with a same frequency but a not completely same phase asthe display driving signal, and the phase difference between the signalwith a preset voltage waveform and the display driving signal may beclose to 0 degree, which can also provide corresponding load reductioneffect.

In another example, in order to reduce load of data lines to which agroup of touch pads are coupled, the signal with a preset voltagewaveform may be a signal with at least one same signal characteristic asthe touch driving signal, where the signal characteristic includes atleast a part of frequency, phase, amplitude, slew rate, and DC offset.

Preferably, the signal with a preset voltage waveform may be a signalwith a same frequency and a same phase as the touch driving signal, soas to better achieve the effect of load reduction. In the case that thesignal with a preset voltage waveform has a same frequency and a samephase as the touch driving signal, the above two kinds of signals mayfurther be the same in at least one signal characteristic, where the atleast one signal characteristic is at least one of amplitude, slew rate,and DC offset. Therefore, when the signal with a preset voltage waveformhaving a same frequency and a same phase as the touch driving signal iscloser to the touch driving signal in other signal characteristic(s),the signal with a preset voltage waveform can perform better loadreduction effect.

In this example, the signal with a preset voltage waveform may have asame frequency as the touch driving signal, and the signal with a presetvoltage waveform is also different from the touch driving signal in atleast one signal characteristic, where the at least one signalcharacteristic is at least one of phase, amplitude, slew rate, and DCoffset. For example, the signal with a preset voltage waveform may be asignal with a same frequency but a not completely same phase as thetouch driving signal, and the phase difference between the signal with apreset voltage waveform and the touch driving signal may be close to 0degree, which can also provide corresponding load reduction effect.

A period during which the signal with a preset voltage waveform isapplied according to an embodiment of the present disclosure will bedescribed below in connection with FIG. 4. FIG. 4 shows a timing diagramof display and touch according to an embodiment of the presentdisclosure.

Specifically, FIG. 4 schematically shows a display frame period 401 witha length of 16.6 ms and a touch frame period 402 with a length of 8.3 msbased on a display scan rate of 60 Hz and a touch scan rate of 120 Hz,where one display frame period 401 is equivalent to two a touch frameperiod 402. The display driving signals are provided during a displayoperation period 403 within each display frame period 401, and the touchdriving signals are provided during a touch operation period 404 withineach touch frame period 402, where the display operation period 403 isat least partially overlapped with the touch operation period 404. Inaddition, each display frame period 401 further includes a plurality offrame scan blanking periods (V blanking periods) 405 and row scanblanking periods (H blanking periods) 406 during which the displaydriving signals are not provided, and each touch frame period 402further includes a touch interval period 407 during which the touchdriving signals are provided.

The isolation pad may be configured to apply the signal with a presetvoltage waveform during the display operation period 403 or during thetouch operation period 404. For example, the isolation pad may beconfigured to apply a signal with a same frequency and a same phase as adisplay driving signal during the display operation period 403, or theisolation pad may be configured to apply a signal with a same frequencyand a same phase as a touch driving signal during the touch operationperiod 404. That is, the isolation pad may be configured to apply thesignal with a preset voltage waveform for reducing load of data lines ortouch electrodes only during a period where there are display drivingsignals or touch driving signals.

Next, an example of a position arrangement of isolation pads and asignal with a preset voltage waveform according to an embodiment of thepresent disclosure will be described in connection with FIG. 11. FIG. 11shows a fourth example of a position arrangement of isolation pads and asignal with a preset voltage waveform according to an embodiment of thepresent disclosure.

As shown in FIG. 11, a first group of isolation pads 1101 are arrangedbetween a first group of display driving pads 1102 and a first group oftouch pads 1103 that are adjacent, which includes a first isolation pad1104 and a second isolation pad 1105. In this example, the firstisolation pad 1104 may be configured to be floated or to apply a signalwith a preset voltage waveform during the touch operation period, wherethe signal with a preset voltage waveform may be a signal with a samefrequency and a same phase as the touch driving signal. That is, thefirst isolation pad 1104 may be configured to be in a floating state orto apply a signal with a same frequency and a same phase as the touchdriving signal, so as to reduce load of touch electrodes to which thefirst group of touch pads 1103 are coupled, thereby improving touchsensitivity.

In this example, the second isolation pad 1105 is arranged between thefirst group of display driving pads 1102 and the first isolation pad1104, and may be configured to apply, during the overlapped operationperiod, a signal with a same frequency and a reverse phase as the touchdriving signal, or a signal with a same frequency and a reverse phase asthe display driving signal of the first group of display driving pads1102. That is, the second isolation pad 1105 may be configured to applya signal with a same frequency and a reverse phase as the touch drivingsignal or the display driving signal, so as to reduce interferencecaused by the touch driving signal or the display driving signal. Forexample, FIG. 11 shows that the second isolation pad 1105 is configuredto apply a signal with a same frequency and a reverse phase as the touchdriving signal, so as to reduce the interference caused by the touchdriving signal. In the case where the second isolation pad 1105 isconfigured to apply a signal with a same frequency and a reverse phaseas the display driving signal of the first group of display driving pads1102, if different pads of the first group of display driving pads 1102have different display driving signals, the signal with a same frequencyand a reverse phase may be applied according to the display drivingsignal on the display driving pad of the first group of display drivingpads 1102 that is closest to the second isolation pad 1105 in position.

FIG. 12 shows a fifth example of a position arrangement of isolationpads and a signal with a preset voltage waveform according to anembodiment of the present disclosure.

As shown in FIG. 12, a first group of isolation pads 1201 are arrangedbetween a first group of display driving pads 1202 and a first group oftouch pads 1203 that are adjacent, which includes a first isolation pad1204 and a second isolation pad 1205. In this example, the firstisolation pad 1204 may be configured to be floated or to apply thesignal with a preset voltage waveform during the display operationperiod, where the signal with a preset voltage waveform may be a signalwith a same frequency and a same phase as the display driving signal ofthe first group of display driving pads 1202. That is, the firstisolation pad 1204 may be configured in a floating state or to apply asignal with a same frequency and a same phase as the display drivingsignal, so as to reduce load of data lines to which the first group ofdisplay driving pads 1202 are coupled, thereby improving display effect.If different pads of the first group of display driving pads 1202 havedifferent display driving signals, the signal with a same frequency anda same phase may be applied according to the display driving signal onthe display driving pad of the first group of display driving pads 1202that is closest to the first isolation pad 1204 in position.

In this example, the second isolation pad 1205 is arranged between thefirst group of touch pads 1202 and the first isolation pad 1204, and maybe configured to apply, during the overlapped operation period, a signalwith a same frequency and a reverse phase as the touch driving signal,or a signal with a same frequency and a reverse phase as the displaydriving signal of the first group of display driving pads 1202. That is,the second isolation pad 1205 may be configured to apply a signal with asame frequency and a reverse phase as the touch driving signal or thedisplay driving signal, so as to reduce interference caused by the touchdriving signal or the display driving signal. For example, FIG. 12 showsthat the second isolation pad 1205 is configured to apply a signal witha same frequency and a reverse phase as the display driving signal ofthe first group of display driving pads 1202, so as to reduce theinterference caused by the display driving signal. Similarly, in thecase where the second isolation pad 1205 is configured to apply a signalwith a same frequency and a reverse phase as the display driving signalof the first group of display driving pads 1202, if different pads ofthe first group of display driving pads 1202 have different displaydriving signals, the signal with a same frequency and a reverse phasemay be applied according to the display driving signal on the displaydriving pad of the group of display driving pads 1202 that is closest tothe second isolation pad 1205 in position.

As described above, in the above case where the signal with a presetvoltage waveform is a signal with a same frequency and a same phase asthe touch driving signal, the above signal with a preset voltagewaveform may further be the same as the touch driving signal in at leastone signal characteristic; and, in the above case where the signal witha preset voltage waveform is a signal with a same frequency and a samephase as the display driving signal of the first group of displaydriving pads, the above signal with the preset voltage waveform mayfurther be the same as the display driving signal of the first group ofdisplay driving pads in at least one signal characteristic, where the atleast one signal characteristic is at least one of amplitude, slew rate,and DC offset. That is, when applying the signal with a same frequencyand a same phase for load reduction, the signal with a same frequencyand a same phase may be made as the same as possible with thecorresponding touch driving signal or display driving signal in othersignal characteristic(s), so as to achieve better load reduction effect.

FIG. 13 shows a sixth example of a position arrangement of isolationpads and a signal with a preset voltage waveform according to anembodiment of the present disclosure.

Compared with the first group of isolation pads 1101 shown in FIG. 11including the first isolation pad 1104 and the second isolation pad1105, the first group of isolation pads 1101 shown in FIG. 13 furtherincludes a third isolation pad 1301 arranged between the first isolationpad 1104 and the second isolation pad 1105. The third isolation pad 1301may be configured to drive an entire layer of isolation electrodesbetween a layer in the OLED display panel structure nearest to the touchelectrodes (for example, the cathode of OLED) and the touch electrodesof the OLED touch display panel, so as to reduce load on the touchelectrodes. Specifically, the third isolation pad 1301 may be configuredto provide, during the touch operation period, a loading free drivingsignal with a same frequency and a same phase as the touch drivingsignal to the isolation electrodes between the cathode of OLED and thetouch electrodes of the OLED touch display panel. Taking a commonon-cell OLED touch display panel as an example, touch electrodes aredisposed above an OLED display panel, and the cathode of OLED of theOLED display panel is closest to the touch electrodes. In anotheron-cell OLED touch display panel, it may be anodes of the OLED that isclosest to the touch electrodes. Therefore, in general, theaforementioned isolation electrodes may be an entire layer of electrodesbetween an OLED display panel and on-cell touch electrodes.

It should be noted that, due to a large load of the entire layer ofisolation electrodes, the slew rate of the loading free driving signalmay be changed, resulting in different slew rates between the loadingfree driving signal and the touch driving signal (as shown by the arrowsin FIG. 13), that is, making the loading free driving signal and thetouch driving signal actually not completely the same in phase.Therefore, in this example, the third isolation pad 1301 is not directlyadjacent to the first group of touch pads 1103, but is directly adjacentto the first isolation pad 1104, and the first isolation pad 1104 may beconfigured to apply a signal with a same frequency and a same phase asthe touch driving signal during the touch operation period, so as toisolate a coupling capacitance between a lead wire of the thirdisolation pad 1301 and an adjacent touch pad lead wire. Alternatively,in another example, the second isolation pad 1105 in FIG. 13 close tothe display driving pads may be configured to apply a signal with a samefrequency and a reverse phase (or close to a reverse phase) as the touchdriving signal to reduce interference caused by the touch drivingsignal.

An OLED touch display apparatus according to an embodiment of thepresent disclosure may include the aforementioned OLED touch and displaydriver integration chip and an OLED touch display panel coupled with theOLED touch and display driver integration chip. At least one lead wireis provided on a substrate of the OLED touch display panel, and at leastone group of isolation pads on the OLED touch and display driverintegration chip are connected to one end of the at least one lead wire.As described above, the other end of the lead wire may extend toward thedirection of the OLED touch display panel and does not extend into theAA area of the OLED touch display panel. The OLED touch and displaydriver integration chip may be bonded with the OLED touch display panelby using any one of the COG, COP and COF packaging structures. Examplesof the OLED touch and display driver integration chip being bonded withan OLED touch display panel by using one of the COG, COP and COFpackaging structures have been described above in connection with FIGS.8-10, which will not be repeatedly described herein.

Therefore, the OLED touch and display driver integration chip and theOLED touch display apparatus including the chip according to theembodiments of the present disclosure may reduce load of data lines ofthe OLED touch display panel to which a group of display driving padsare coupled, or load of touch electrodes on the OLED touch display panelto which a group of touch pads are coupled, and may further reduceinterference between a group of display driving pads and a group oftouch pads that are adjacent, thereby achieving better display effectand touch sensitivity.

Although the present disclosure has been disclosed in the aboveembodiments, they are not intended to limit the present disclosure.Anyone with ordinary knowledge in the relevant technical field can makesome changes and modifications without departing from the spirit andscope of the present disclosure. Therefore, the protection scope of thepresent disclosure shall be subject to those defined by the appendedclaims.

What is claimed is:
 1. An OLED touch and display driver integration chipfor driving an OLED touch display panel, the OLED touch and displaydriver integration chip comprising: at least one group of displaydriving pads for providing display driving signals to the OLED touchdisplay panel; at least one group of touch pads for providing touchdriving signals to touch electrodes on the OLED touch display panel, andalternately arranged in groups with the at least one group of displaydriving pads; and at least one group of isolation pads, wherein eachgroup of isolation pads includes at least one isolation pad and isarranged between a group of display driving pads and a group of touchpads that are adjacent, and an isolation pad of the at least one groupof isolation pads is configured to apply a specific signal to isolatesignal interference between the group of display driving pads and thegroup of touch pads that are adjacent.
 2. The OLED touch and displaydriver integration chip of claim 1, wherein the isolation pads areconfigured to connect to one ends of lead wires, the other ends of thelead wires extend toward a direction of the OLED touch display panel anddoes not extend into a display active area of the OLED touch displaypanel, or the other ends of the lead wires extend to an edge of a fanoutarea of the OLED touch display panel and does not extend into the fanoutarea.
 3. The OLED touch and display driver integration chip of claim 1,wherein the specific signal is one of: a ground signal, a signal with afixed potential, and a signal with a preset voltage waveform.
 4. TheOLED touch and display driver integration chip of claim 3, wherein thesignal with a preset voltage waveform is a signal with at least one samesignal characteristic and at least one different signal characteristicas a display driving signal, wherein the signal characteristic includesat least a part of frequency, phase, amplitude, slew rate and DC offset.5. The OLED touch and display driver integration chip of claim 4,wherein the signal with a preset voltage waveform has a same frequencyand a reverse phase as the display driving signal.
 6. The OLED touch anddisplay driver integration chip of claim 4, wherein the signal with apreset voltage waveform has a same frequency and a reverse phase as thedisplay driving signal, and the signal with a preset voltage waveform isfurther the same as the display driving signal in at least one signalcharacteristic, wherein the at least one signal characteristic is atleast one of amplitude, slew rate, and DC offset.
 7. The OLED touch anddisplay driver integration chip of claim 4, wherein the signal with apreset voltage waveform has a same frequency as the display drivingsignal, and the signal with a preset voltage waveform is furtherdifferent from the display driving signal in at least one signalcharacteristic, wherein the at least one signal characteristic is atleast one of phase, amplitude, slew rate and DC offset.
 8. The OLEDtouch and display driver integration chip of claim 3, wherein the signalwith a preset voltage waveform is a signal with at least one same signalcharacteristic and at least one different signal characteristic as atouch driving signal, wherein the signal characteristic includes atleast a part of frequency, phase, amplitude, slew rate and DC offset. 9.The OLED touch and display driver integration chip of claim 8, whereinthe signal with a preset voltage waveform has a same frequency and areverse phase as the touch driving signal.
 10. The OLED touch anddisplay driver integration chip of claim 8, wherein the signal with apreset voltage waveform has a same frequency and a reverse phase as thetouch driving signal, and the signal with a preset voltage waveform isfurther the same as the touch driving signal in at least one signalcharacteristic, wherein the at least one signal characteristic is atleast one of amplitude, slew rate, and DC offset.
 11. The OLED touch anddisplay driver integration chip of claim 8, wherein the signal with apreset voltage waveform has a same frequency as the touch drivingsignal, and the signal with a preset voltage waveform is furtherdifferent from the touch driving signal in at least one signalcharacteristic, wherein the at least one signal characteristic is atleast one of phase, amplitude, slew rate and DC offset.
 12. The OLEDtouch and display driver integration chip of claim 3, wherein, thedisplay driving signals are provided during a display operation periodwithin each of a plurality of display frame periods, and the touchdriving signals are provided during a touch operation period within eachof a plurality of touch frame periods, wherein the display operationperiod and the touch operation period are at least partially overlapped,and, at least one isolation pad of the at least one group of isolationpads is configured to apply the signal with a preset voltage waveformduring an overlapped operation period in which the display operationperiod and the touch operation period are at least partially overlapped.13. The OLED touch and display driver integration chip of claim 12,wherein, each display frame period further includes frame scan blankingperiods and row scan blanking periods in which the display drivingsignals are not provided, and each touch frame period further includes atouch interval period in which the touch driving signals are notprovided, wherein the at least one isolation pad is further configuredto apply the ground signal or be in a floating state during at least oneof the frame scan blanking periods, the row scan blanking periods andthe touch interval period.
 14. The OLED touch and display driverintegration chip of claim 12, wherein the at least one group ofisolation pads includes a first group of isolation pads arranged betweena first group of display driving pads and a first group of touch padsthat are adjacent, and, the first group of isolation pads includes: afirst isolation pad configured to apply the signal with a preset voltagewaveform during the overlapped operation period, wherein the signal witha preset voltage waveform is a signal with a same frequency and areverse phase as a touch driving signal, or a signal with a samefrequency and a reverse phase as a display driving signal of the firstgroup of display driving pads; and a second isolation pad arrangedbetween the first group of touch pads and the first isolation pad, andconfigured to be floated or apply a signal with a same frequency and asame phase as the touch driving signal during the touch operationperiod.
 15. The OLED touch and display driver integration chip of claim12, wherein the at least one group of isolation pads includes a firstgroup of isolation pads arranged between a first group of displaydriving pads and a first group of touch pads that are adjacent, and, thefirst group of isolation pads includes: a first isolation pad configuredto apply the signal with a preset voltage waveform during the overlappedoperation period, wherein the signal with a preset voltage waveform is asignal with a same frequency and a reverse phase as a touch drivingsignal, or a signal with a same frequency and a reverse phase as adisplay driving signal of the first group of display driving pads; and asecond isolation pad arranged between the first group of display drivingpads and the first isolation pad, and configured to be floated or applya signal with a same frequency and a same phase as the display drivingsignal of the first group of display driving pads during the displayoperation period.
 16. The OLED touch and display driver integration chipof claim 15, wherein, in the case that the signal with a preset voltagewaveform is a signal with a same frequency and a reverse phase as thetouch driving signal, the signal with a preset voltage waveform isfurther the same as the touch driving signal in at least one signalcharacteristic, and, in the case that the signal with a preset voltagewaveform is a signal with a same frequency and a reverse phase as thedisplay driving signal of the first group of display driving pads, thesignal with a preset voltage waveform is further the same as the displaydriving signal of the first group of display driving pads in at leastone signal characteristic, wherein the at least one signalcharacteristic is at least one of amplitude, slew rate and DC offset.17. The OLED touch and display driver integration chip of claim 15,wherein, each display frame period further includes frame scan blankingperiods and row scan blanking periods in which the display drivingsignals are not provided, and each touch frame period further includes atouch interval period in which the touch driving signals are notprovided, wherein the at least one isolation pad is further configuredto apply the ground signal or be in a floating state during at least oneof the frame scan blanking periods, the row scan blanking periods andthe touch interval period.
 18. The OLED touch and display driverintegration chip of claim 14, wherein the first group of isolation padsfurther includes: a third isolation pad arranged between the firstisolation pad and the second isolation pad, and configured to provide aloading free driving signal to isolation electrodes between cathode andthe touch electrodes of the OLED touch display panel during the touchoperation period, wherein the loading free driving signal provided bythe third isolation pad has a same frequency and a same phase as thetouch driving signal.
 19. The OLED touch and display driver integrationchip of claim 18, wherein the loading free driving signal has adifferent slew rate as the touch driving signal.
 20. An OLED touchdisplay apparatus, comprising: the OLED touch and display driverintegration chip of claim 1; and an OLED touch display panel coupledwith the OLED touch and display driver integration chip.
 21. The OLEDtouch display apparatus of claim 20, wherein at least one lead wire isarranged on a substrate of the OLED touch display panel, and the atleast one group of isolation pads on the OLED touch and display driverintegration chip are connected to one end of the at least one lead wire.22. The OLED touch display apparatus of claim 21, wherein the OLED touchand display driver integration chip is bonded with the OLED touchdisplay panel by using a COG or COP packaging structure, and the atleast one group of isolation pads on the OLED touch and display driverintegration chip are directly connected to the at least one lead wire.23. The OLED touch display apparatus of claim 21, wherein the OLED touchand display driver integration chip is bonded with the OLED touchdisplay panel by using a COF packaging structure, and the at least onegroup of isolation pads on the OLED touch and display driver integrationchip are connected to the at least one lead wire via at least oneadditional lead wire on a FPC on which the OLED touch and display driverintegration chip is packaged.
 24. The OLED touch display apparatus ofclaim 23, wherein the at least one lead wire extends to an edge of adisplay active area of the OLED touch display panel and does not extendinto the display active area.
 25. The OLED touch display apparatus ofclaim 20, wherein the OLED touch and display driver integration chip isbonded with the OLED touch display panel by using a COF packagingstructure, and the at least one group of isolation pads on the OLEDtouch and display driver integration chip are directly connected to atleast one lead wire on a FPC on which the OLED touch and display driverintegration chip is packaged, and the at least one lead wire extends toan edge of a fanout area of the OLED touch display panel and does notextend into the fanout area.
 26. An OLED touch and display driverintegration chip for driving an OLED touch display panel, the OLED touchand display driver integration chip comprising: at least one group ofdisplay driving pads for providing display driving signals to the OLEDtouch display panel; at least one group of touch pads for providingtouch driving signals to touch electrodes on the OLED touch displaypanel, and alternately arranged in groups with the at least one group ofdisplay driving pads; and at least one group of isolation pads, whereineach group of isolation pads includes at least one isolation pad and isarranged between a group of display driving pads and a group of touchpads that are adjacent, and an isolation pad of the at least one groupof isolation pads is configured to apply a specific signal or be in afloating state, to reduce load of data lines of the OLED touch displaypanel to which the group of display driving pads are coupled, or load ofthe touch electrodes on the OLED touch display panel to which the groupof touch pads are coupled.
 27. The OLED touch and display driverintegration chip of claim 26, wherein the isolation pads are configuredto connect to one ends of lead wires, the other ends of the lead wiresextend toward a direction of the OLED touch display panel and does notextend into a display active area of the OLED touch display panel, orthe other ends of the lead wires extend to an edge of a fanout area ofthe OLED touch display panel and does not extend into the fanout area.28. The OLED touch and display driver integration chip of claim 26,wherein the specific signal is one of: a ground signal, a signal with afixed potential, and a signal with a preset voltage waveform.
 29. TheOLED touch and display driver integration chip of claim 28, wherein thesignal with a preset voltage waveform is a signal with at least one samesignal characteristic and at least one different signal characteristicas a display driving signal, wherein the signal characteristic includesat least a part of frequency, phase, amplitude, slew rate and DC offset.30. The OLED touch and display driver integration chip of claim 29,wherein the signal with a preset voltage waveform has a same frequencyand a reverse phase as the display driving signal.
 31. The OLED touchand display driver integration chip of claim 29, wherein the signal witha preset voltage waveform has a same frequency and a same phase as thedisplay driving signal, and the signal with a preset voltage waveform isfurther the same as the display driving signal in at least one signalcharacteristic, wherein the at least one signal characteristic is atleast one of amplitude, slew rate, and DC offset.
 32. The OLED touch anddisplay driver integration chip of claim 29, wherein the signal with apreset voltage waveform has a same frequency as the display drivingsignal, and the signal with a preset voltage waveform is furtherdifferent from the display driving signal in at least one signalcharacteristic, wherein the at least one signal characteristic is atleast one of phase, amplitude, slew rate and DC offset.
 33. The OLEDtouch and display driver integration chip of claim 28, wherein thesignal with a preset voltage waveform is a signal with at least one samesignal characteristic and at least one different signal characteristicas a touch driving signal, wherein the signal characteristic includes atleast a part of frequency, phase, amplitude, slew rate and DC offset.34. The OLED touch and display driver integration chip of claim 33,wherein the signal with a preset voltage waveform has a same frequencyand a same phase as the touch driving signal.
 35. The OLED touch anddisplay driver integration chip of claim 33, wherein the signal with apreset voltage waveform has a same frequency and a same phase as thetouch driving signal, and the signal with a preset voltage waveform isfurther the same as the touch driving signal in at least one signalcharacteristic, wherein the at least one signal characteristic is atleast one of amplitude, slew rate, and DC offset.
 36. The OLED touch anddisplay driver integration chip of claim 33, wherein the signal with apreset voltage waveform has a same frequency as the touch drivingsignal, and the signal with a preset voltage waveform is furtherdifferent from the touch driving signal in at least one signalcharacteristic, wherein the at least one signal characteristic is atleast one of phase, amplitude, slew rate and DC offset.
 37. The OLEDtouch and display driver integration chip of claim 28, wherein, thedisplay driving signals are provided during a display operation periodwithin each of a plurality of display frame periods, and the touchdriving signals are provided during a touch operation period within eachof a plurality of touch frame periods, wherein the display operationperiod and the touch operation period are at least partially overlapped,and, at least one isolation pad of the at least one group of isolationpads is configured to apply the signal with a preset voltage waveformduring the display operation period or the touch operation period. 38.The OLED touch and display driver integration chip of claim 37, whereinthe at least one group of isolation pads includes a first group ofisolation pads arranged between a first group of display driving padsand a first group of touch pads that are adjacent, and, the first groupof isolation pads includes: a first isolation pad configured to befloated or apply the signal with a preset voltage waveform during thetouch operation period, wherein the signal with a preset voltagewaveform is a signal with a same frequency and a same phase as a touchdriving signal; and a second isolation pad arranged between the firstgroup of display driving pads and the first isolation pad, andconfigured to apply, during an overlapped operation period in which thedisplay operation period and the touch operation period are at leastpartially overlapped, a signal with a same frequency and a reverse phaseas a touch driving signal, or a signal with a same frequency and areverse phase as a display driving signal of the first group of displaydriving pads.
 39. The OLED touch and display driver integration chip ofclaim 37, wherein the at least one group of isolation pads includes afirst group of isolation pads arranged between a first group of displaydriving pads and a first group of touch pads that are adjacent, and, thefirst group of isolation pads includes: a first isolation pad configuredto be floated or apply the signal with a preset voltage waveform duringthe display operation period, wherein the signal with a preset voltagewaveform is a signal with a same frequency and a same phase as a displaydriving signal of the first group of display driving pads; and a secondisolation pad arranged between the first group of touch pads and thefirst isolation pad, and configured to apply, during an overlappedoperation period in which the display operation period and the touchoperation period are at least partially overlapped, a signal with a samefrequency and a reverse phase as a touch driving signal or a signal witha same frequency and a reverse phase as the display driving signal ofthe first group of display driving pads.
 40. The OLED touch and displaydriver integration chip of claim 39, wherein, in the case that thesignal with a preset voltage waveform is a signal with a same frequencyand a same phase as the touch driving signal, the signal with a presetvoltage waveform is further the same as the touch driving signal in atleast one signal characteristic, and, in the case that the signal with apreset voltage waveform is a signal with a same frequency and a samephase as the display driving signal of the first group of displaydriving pads, the signal with a preset voltage waveform is further thesame as the display driving signal of the first group of display drivingpads in at least one signal characteristic, wherein the at least onesignal characteristic is at least one of amplitude, slew rate and DCoffset.
 41. The OLED touch and display driver integration chip of claim39, wherein the first group of isolation pads further includes: a thirdisolation pad arranged between the first isolation pad and the secondisolation pad, and configured to provide a loading free driving signalto isolation electrodes between cathode and the touch electrodes of theOLED touch display panel during the touch operation period, wherein theloading free driving signal provided by the third isolation pad has asame frequency and a same phase as the touch driving signal.
 42. TheOLED touch and display driver integration chip of claim 41, wherein theloading free driving signal has a different slew rate as the touchdriving signal.
 43. An OLED touch display apparatus, comprising: theOLED touch and display driver integration chip of claim 26; and an OLEDtouch display panel coupled with the OLED touch and display driverintegration chip.
 44. The OLED touch display apparatus of claim 43,wherein at least one lead wire is arranged on a substrate of the OLEDtouch display panel, and the at least one group of isolation pads on theOLED touch and display driver integration chip are connected to one endof the at least one lead wire.
 45. The OLED touch display apparatus ofclaim 44, wherein the OLED touch and display driver integration chip isbonded with the OLED touch display panel by using a COG or COP packagingstructure, and the at least one group of isolation pads on the OLEDtouch and display driver integration chip are directly connected to theat least one lead wire.
 46. The OLED touch display apparatus of claim44, wherein the OLED touch and display driver integration chip is bondedwith the OLED touch display panel by using a COF packaging structure,and the at least one group of isolation pads on the OLED touch anddisplay driver integration chip are connected to the at least one leadwire via at least one additional lead wire on a FPC on which the OLEDtouch and display driver integration chip is packaged.
 47. The OLEDtouch display apparatus of claim 46, wherein the at least one lead wireextends to an edge of a display active area of the OLED touch displaypanel and does not extend into the display active area.
 48. The OLEDtouch display apparatus of claim 43, wherein the OLED touch and displaydriver integration chip is bonded with the OLED touch display panel byusing a COF packaging structure, and the at least one group of isolationpads on the OLED touch and display driver integration chip are directlyconnected to at least one lead wire on a FPC on which the OLED touch anddisplay driver integration chip is packaged, and the at least one leadwire extends to an edge of a fanout area of the OLED touch display paneland does not extend into the fanout area.